凭借 50 年卓越创新、协作和工程技术能力，Broadcom 成为了一家多元化的全球半导体领军企业。Broadcom 范围广泛的产品组合应用于四个主要终端市场：有线基础设施、无线通信、企业级存储以及工业市场。我们的产品在这些终端市场中的应用包括：数据中心网络、网络家居、宽带接入、电信设备、智能手机和基站、数据中心服务器和存储器、工厂自动化、替代能源系统以及显示器。
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Description FCBGA+HS 29X29 779 |
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Description FCBGA+HS 2 |
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Description FCBGA+HS 29X29 779 |
In Stock: 1000 $2.66 |
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Description FCBGA+HS 29 |
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XLP104B0IFSB00080GBroadcom |
Description FCBGA+HS 29X29 779 |
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Description FCBGA+HS 29X29 779 |
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Description FCBGA+HS 31X31 896 |
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Description FCBGA+HS 31X31 896 |
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Description FCBGA+HS 35X |
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Description FCBGA+HS 35X35 1152 |
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Description FCBGA+HS 35X35 1152 |
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Description SECURE PROCESSOR |
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Description SECURE PROCESSOR |
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Description SECURE PROCESSOR |
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Description INTEGRATED CPU WITH 5-PORT ETH |
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Description INTEGRATED CPU WITH 5-PORT ETH |
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Description INTEGRATED CPU WITH 5-PORT ETH |
In Stock: 1000 $2.66 |
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Description INTEGRATED CPU WITH 5-PORT ETH |
In Stock: 1000 $2.66 |
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Description DUAL CORE 1.GHZ A9 SOC W/2 GPH |
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Description 3+3 GE WLAN CHIPSET |
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